Designed Specifically for Epoxy Resins
Silica Filler for Epoxy is a special filler for epoxy resin systems. Epoxy is very strict about fillers. The filler affects not just the mechanical properties of the cured material. It also impacts dielectric performance, heat conductivity, and heat resistance. Our product has high purity, low oil absorption, and great chemical inertness. These traits allow high loading without a big increase in system viscosity. This reduces curing shrinkage while keeping good flow. This feature is especially important in electronic packaging and high-voltage insulation manufacturing.
Proven Performance in Electronic Packaging
In electronic packaging, our Silica Filler for Epoxy has become a core choice for many epoxy molding compound and potting compound makers. We do not just provide standard products. We understand your different application needs. For semiconductor molding compounds, you need ultra-low alpha particles and very low ion content. For high-voltage insulation casting, you need low dielectric loss and resistance to partial discharge. For these different needs, we offer product in different purity levels and particle size blends. Our sales and technical team will talk with you during the selection stage. We make sure you get the best product match.
Technical Data for Your Formulation
|
Parameter |
Typical Value / Range |
Test Standard |
|
Main Content (SiO₂) |
≥ 99.3% |
Chemical Analysis |
|
Oil Absorption |
16 - 24 g/100g |
Scraper Method |
|
Particle Size (D50) |
3μm - 25μm (Customizable) |
Laser Diffraction |
|
Maximum Particle Size (D99) |
≤ 50μm (Controllable) |
Laser Diffraction |
|
Dielectric Constant (1MHz) |
≤ 4.5 |
Dielectric Loss Tester |
|
Conductivity (Water Suspension) |
≤ 12 μS/cm |
Conductivity Meter |
|
Moisture Content |
≤ 0.15% |
Oven Drying Method |
Key Applications and Custom Options
Silica Filler for Epoxy focuses on high-end epoxy applications. In semiconductor and microelectronics packaging, it is used in IC molding compounds, LED encapsulants, and underfill materials. It lowers the thermal expansion of the packaging material and improves thermal cycle reliability. In high-voltage equipment, it serves as a core filler for insulation casting compounds in GIS, transformers, and insulators. It keeps electrical devices reliable under long-term high-voltage operation. We can customize the particle size blend for your specific epoxy formulation. We also offer silane-treated versions for better interfacial bonding. The minimum order is 1 ton.
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