High Loading Capability for Epoxy Systems
Epoxy Silica Filler is a professional filler for epoxy resin applications. It is different from general-purpose silica powders. Our product has a particle size design specifically for high loading and low viscosity. Through a proper blend of coarse and fine particles, we achieve lower system viscosity at the same filling level. We also get better flow properties. This is very valuable for processes like electronic potting, insulation casting, and composite molding. These processes need good wetting and air release.
Real Application Success Stories
Our Epoxy Silica Filler has achieved solid results in many epoxy applications. In high-voltage insulation part manufacturing, it helps customers achieve higher filler loading. This effectively reduces curing shrinkage and thermal expansion. In electronic component potting, its high purity and low ion content protect the long-term electrical reliability of the devices. These results come from our strict ISO 9001:2008 quality system. Our engineering team controls every batch of product from raw material to final product. Our Sales Director Yao Bin and his team are ready to give you professional product selection and formulation advice.
Technical Parameters for Your Reference
|
Parameter |
Typical Value / Range |
Test Standard |
|
Main Content (SiO₂) |
≥ 99.3% |
Chemical Analysis |
|
Oil Absorption |
16 - 22 g/100g |
Scraper Method |
|
Particle Size (D50) |
2μm - 20μm (Customizable) |
Laser Diffraction |
|
Maximum Particle Size (D99) |
≤ 45μm (Controllable) |
Laser Diffraction |
|
Dielectric Constant (1MHz) |
≤ 4.5 |
Dielectric Loss Tester |
|
Volume Resistivity |
≥ 1×10¹⁴ Ω·cm |
High Resistance Meter |
|
Conductivity (Water Suspension) |
≤ 10 μS/cm |
Conductivity Meter |
|
Moisture Content |
≤ 0.15% |
Oven Drying Method |
Professional Applications and Custom Blends
Epoxy Silica Filler focuses on high-end epoxy technology fields. In electronics, it is used in semiconductor molding compounds, LED encapsulants, PCB copper-clad laminates, and underfill materials. Its low thermal expansion and high insulation are key for electronic device reliability. In power equipment, it is a filler for high-voltage insulation casting compounds and dry-type transformers. It ensures long-term stability under harsh operating conditions. We can customize the particle size blend and surface treatment for your specific epoxy formulation. The minimum order is 1 ton.
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