Ultra-High Purity for Semiconductor Packaging
Electronic Grade Silica Powder is one of the most critical materials in electronic packaging and component manufacturing. It has extremely high purity, very low ion content, and excellent dielectric properties. These traits make it essential in semiconductor molding compounds, electronic potting compounds, and copper-clad laminate manufacturing. Our product uses the highest standard raw material selection and processing. From special mining to final packaging, every step is under strict clean control. This ensures the product contains no harmful impurities that could affect the long-term reliability of electronic devices.
Compliant with Industry Standards
Our Electronic Grade Silica Powder follows the SJ/T 10675-1995 standard for quality management and testing. For purity, our product has an SiO₂ content above 99.5%. Conductivity is below 8 μS/cm. Iron, sodium, and potassium ions are all kept at very low levels. For particle size, we use advanced laser diffraction technology. This ensures a uniform and concentrated particle size distribution. These performance indicators have been recognized by many well-known electronic packaging material companies. Our product is now supplied to several A-share listed electronic material companies. We also export to electronic manufacturing centers in Southeast Asia.
Detailed Electrical and Physical Data
|
Parameter |
Typical Value / Range |
Test Standard |
|
Main Content (SiO₂) |
≥ 99.5% |
Chemical Analysis |
|
Conductivity (Water Suspension) |
≤ 8 μS/cm |
Conductivity Meter |
|
Dielectric Constant (1MHz) |
≤ 4.3 |
Dielectric Loss Tester |
|
Volume Resistivity |
≥ 2×10¹⁴ Ω·cm |
High Resistance Meter |
|
Particle Size (D50) |
2μm - 10μm (Customizable) |
Laser Diffraction |
|
Maximum Particle Size (D99) |
≤ 30μm |
Laser Diffraction |
|
Iron Content (Fe₂O₃) |
≤ 0.03% |
Spectrophotometry |
|
Sodium Content (Na₂O) |
≤ 0.01% |
Atomic Absorption Spectroscopy |
|
Moisture Content |
≤ 0.10% |
Oven Drying Method |
Core Applications and Custom Grading
Electronic Grade Silica Powder focuses on the most critical steps in electronics. In semiconductor packaging, it is the main filler in epoxy molding compounds (EMC). The filling level often reaches 70%-90%. It plays a decisive role in thermal expansion, thermal conductivity, and reliability. In electronic potting and sealing, it protects power modules, sensors, and ICs. In copper-clad laminate manufacturing, it improves dimensional stability and heat resistance. We offer custom particle size grading for your EMC or potting needs. The minimum order is 1 ton.
Hot Tags: electronic grade silica powder, China electronic grade silica powder manufacturers, suppliers, factory, 1250 Mesh Silica Powder, 1500 Mesh Silica Powder, 2000 Mesh Silica Powder, 600 Mesh Silica Powder, 800 Mesh Silica Powder, ordinary silicon powder
