Product Overview
Spherical Silica Powder is produced from high-purity silicon dioxide by flame fusion, giving the particles a spherical shape. It is used in resin systems where high filler loading and low mix viscosity are required, such as epoxy molding compounds and electronic encapsulation.
Core Advantages
Sphericity ≥90%. The spherical shape reduces inter-particle friction and specific surface area. In epoxy molding compounds, this allows higher filler loading at the same viscosity compared with irregular particles.
SiO₂ content ≥99.5%, loss on ignition ≤0.08%. Low LOI and low impurity content reduce the risk of outgassing and contamination in electronic packaging and copper clad laminate systems.
Particle size 1–50 μm adjustable. This range covers the common particle sizes used in epoxy molding compounds, encapsulants, and thermal interface materials.
Low specific surface area. In resin systems, lower specific surface area reduces resin demand for wetting, which can lower mix viscosity and improve flow during encapsulation.
Moisture ≤0.10%. Controlled moisture supports stable storage and reduces the risk of voids during curing.
Application Scenarios
• Epoxy molding compounds (EMC)
• Copper clad laminates (CCL)
• Integrated circuit packaging
• Electronic encapsulants
• Epoxy casting compounds
• Thermal interface materials
Specifications
|
Item |
Typical Value |
|
SiO₂ Content |
≥99.5% |
|
Loss on Ignition |
≤0.08% |
|
Sphericity |
≥90% |
|
Particle Size Range |
1–50 μm, adjustable |
|
Moisture |
≤0.10% |
|
Packaging |
25 kg paper-plastic bag / jumbo bag |
|
MOQ |
1 ton |
|
Lead Time |
7–10 days (standard); within 20 days (customized) |
Customization range: particle size distribution can be adjusted based on customer sample or technical requirement.
Quality Control
Each batch of Spherical Silica Powder is tested in the laboratory before packaging. Testing equipment includes a swing vibrating sieve, laboratory sieve shaker, laboratory ball mill, conductivity meter, and viscometer. The viscometer check is directly relevant to this product because viscosity behavior in resin systems is a key selection criterion for epoxy molding and encapsulation applications.
Batches that do not meet the confirmed sphericity and particle size specification are not released for packaging.
FAQ
Q: Is Spherical Silica Powder suitable for epoxy systems?
A: Yes. The spherical structure supports higher filler loading and improved flow. The specific grade should be confirmed against your epoxy system and viscosity requirement.
Q: Can I get a sample for testing?
A: Yes. We provide a 1 kg free sample; freight is paid by the customer. You can test it before deciding on bulk purchase.
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