Electrical grade silica powder is a special product obtained by further applying surface activation treatment on the basis of the high purity and low radioactivity of Electronic Silica Powder. The coupling agents used must also meet electronic-grade purity requirements and cannot introduce any ions or substances harmful to the circuit.
This product is developed to address the increasingly severe reliability challenges in high-end electronic packaging. In ultra-large-scale integrated circuits (VLSI) and ultra-fine pitch packaging, interface failure is one of the main causes of early device failure. Electrical grade silica powder forms strong chemical bonds with the matrix such as epoxy resin through the coupling agent on its surface, greatly enhancing the interfacial bond strength, effectively preventing interface delamination during damp heat testing (e.g., 85°C/85%RH) or due to temperature cycling (TCT). This is crucial for high-reliability fields requiring zero defects, such as automotive electronics and aerospace electronics. Simultaneously, strong interfacial bonding also means that the filler can more effectively restrict the movement of polymer chains, thereby helping to further reduce the CTE of the composite material and increase its glass transition temperature (Tg) and modulus at high temperatures. In high-speed digital circuits and high-frequency analog circuits, a stable interface can reduce interface polarization phenomena, helping to maintain stable dielectric properties. Therefore, Electrical grade silica powder is an essential key material for manufacturing high-reliability, long-life advanced semiconductor packaging materials.
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