Electronic Grade Active Silica Powder

Electronic Grade Active Silica Powder is an upgraded product. It starts with Electronic Grade Silica Powder. Then we modify the surface with a silane coupling agent. This chemical treatment changes the powder surface from hydrophilic to organophilic. It significantly improves the interfacial bonding with epoxy and polyimide resins. This does not reduce electrical performance. But it greatly improves the mechanical properties and moisture resistance of the packaging material.

The benefits of Electronic Grade Active Silica Powder are very clear in semiconductor molding compounds. The activated powder is more compatible with epoxy resin. It keeps good wetting and dispersion even at high loading. This gives three direct benefits. First, the flow improves during injection molding. Second, there are fewer voids and defects after curing. Third, the packaged devices are more reliable in hot and humid environments. Our customers report that after using product, their product moisture absorption dropped by 15%-20%. Performance retention after high-temperature, high-humidity aging also improved significantly.

Electronic Grade Active Silica Powder is used in high-end electronic packaging. In semiconductor molding compounds, it serves as the activated main filler. It effectively improves the interfacial bond between the compound and the chip/lead frame. In electronic potting and underfill, its good wettability ensures precise filling of small gaps. In high-performance copper-clad laminates, the surface activity improves interfacial bond strength and mechanical performance. We can customize the coupling agent type and activation level for your resin system. The minimum order is 1 ton.

Hot Tags: electronic grade active silica powder, China electronic grade active silica powder manufacturers, suppliers, factory, 1000 Mesh Silica Powder, 1250 Mesh Silica Powder, 1500 Mesh Silica Powder, 300 Mesh Silica Powder, 600 Mesh Silica Powder, ordinary silicon powder